Bumili 74F156AP-RC sa BYCHPS
Bumili na may garantiya
74F156AP-RC
- Numero ng Bahagi:
- 74F156AP-RC
- Manufacturer:
- Bourns, Inc.
- Paglalarawan:
- FIXED IND 1.5UH 900MA 250 MOHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15953 Pieces
- Data sheet:
- 74F156AP-RC.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 74F156AP-RC, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 74F156AP-RC sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±20% |
| Supplier aparato Package: | Axial |
| Sukat / Dimension: | 0.200" Dia x 0.500" L (5.08mm x 12.70mm) |
| shielding: | Unshielded |
| serye: | 74F |
| Ratings: | - |
| Q @ Freq: | 45 @ 7.96MHz |
| packaging: | Bulk |
| Package / Kaso: | Axial |
| Ibang pangalan: | 74F156APRC |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Phenolic |
| Manufacturer Bilang Bahagi: | 74F156AP-RC |
| inductance: | 1.5µH |
| Taas - Makaupo (Max): | - |
| Frequency - Test: | 7.96MHz |
| Frequency - Self Resonant: | 160MHz |
| Ang pinalawak Paglalarawan: | 1.5µH Unshielded Wirewound Inductor 900mA 250 mOhm Max Axial |
| paglalarawan: | FIXED IND 1.5UH 900MA 250 MOHM |
| DC pagtutol (DCR): | 250 mOhm Max |
| kasalukuyang Rating: | 900mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 74F156AP-RC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers