Bumili 74LVT162245BDGG:51 sa BYCHPS
Bumili na may garantiya
74LVT162245BDGG:51
- Numero ng Bahagi:
- 74LVT162245BDGG:51
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- IC TRANSCVR TRI-ST 16BIT 48TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12804 Pieces
- Data sheet:
- 74LVT162245BDGG:51.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 74LVT162245BDGG:51, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 74LVT162245BDGG:51 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 48-TSSOP |
| serye: | 74LVT |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 48-TFSOP (0.240", 6.10mm Width) |
| Type output: | Push-Pull |
| Ibang pangalan: | 568-2312-2 74LVT162245BDG-T 935204110518 |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng mga Sangkap: | 2 |
| Bilang ng mga Bits per Element: | 8 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Bilang Bahagi: | 74LVT162245BDGG:51 |
| logic Type: | Transceiver, Non-Inverting |
| Type input: | - |
| Ang pinalawak Paglalarawan: | Transceiver, Non-Inverting Element 8 Bit per Element Push-Pull Output 48-TSSOP |
| paglalarawan: | IC TRANSCVR TRI-ST 16BIT 48TSSOP |
| Current - Output Mataas, Mababa: | 12mA, 12mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 74LVT162245BDGG:51
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers