Bumili 74SSTUB32865AZJBR sa BYCHPS
Bumili na may garantiya
74SSTUB32865AZJBR
- Numero ng Bahagi:
- 74SSTUB32865AZJBR
- Manufacturer:
- Paglalarawan:
- IC REGSTR BUFF 28-56BIT 160NFBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16045 Pieces
- Data sheet:
- 74SSTUB32865AZJBR.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 74SSTUB32865AZJBR, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 74SSTUB32865AZJBR sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supply Boltahe: | 1.7 V ~ 1.9 V |
|---|---|
| Supplier aparato Package: | 160-NFBGA (9x13) |
| serye: | 74SSTUB |
| packaging: | Original-Reel® |
| Package / Kaso: | 160-TFBGA |
| Ibang pangalan: | 296-24689-6 |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng mga Bits: | 28 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 74SSTUB32865AZJBR |
| logic Type: | 1:2 Registered Buffer with Parity |
| Ang pinalawak Paglalarawan: | 1:2 Registered Buffer with Parity IC 160-NFBGA (9x13) |
| paglalarawan: | IC REGSTR BUFF 28-56BIT 160NFBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 74SSTUB32865AZJBR
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
|
74SSTUB32864AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Pagtatanong |
|
74SSTUB32865ZJBR | Texas Instruments | IC REGISTERED BUFFER 160-TFBGA | Pagtatanong |
|
74SSTUB32866AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Pagtatanong |
|
74SSTUB32868AZRHR | Texas Instruments | IC REGSTR BUFFER 28-56BIT 176BGA | Pagtatanong |
|
74SSTUB32868ZRHR | Texas Instruments | IC CONFIG REG BUFF 28BIT 176-BGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers