Bumili 83026BGI-01LFT sa BYCHPS
Bumili na may garantiya
83026BGI-01LFT
- Numero ng Bahagi:
- 83026BGI-01LFT
- Manufacturer:
- IDT (Integrated Device Technology)
- Paglalarawan:
- IC CLK BUFFER 1:2 350MHZ 8TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16417 Pieces
- Data sheet:
- 83026BGI-01LFT.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 83026BGI-01LFT, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 83026BGI-01LFT sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3.135 V ~ 3.465 V |
|---|---|
| uri: | Fanout Buffer (Distribution) |
| Supplier aparato Package: | 8-TSSOP |
| serye: | - |
| Ratio - Input: Output: | 1:2 |
| packaging: | Original-Reel® |
| Package / Kaso: | 8-TSSOP (0.173", 4.40mm Width) |
| output: | LVCMOS, LVTTL |
| Ibang pangalan: | 800-2778-6 |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng Circuits: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | 83026BGI-01LFT |
| input: | HCSL, LVDS, LVHSTL, LVPECL, SSTL |
| Frequency - Max: | 350MHz |
| Ang pinalawak Paglalarawan: | Clock Fanout Buffer (Distribution) IC 350MHz 8-TSSOP (0.173", 4.40mm Width) |
| Differential - Input: Output: | Yes/No |
| paglalarawan: | IC CLK BUFFER 1:2 350MHZ 8TSSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 83026BGI-01LFT
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers