Bumili 8869570000 sa BYCHPS
Bumili na may garantiya
8869570000
- Numero ng Bahagi:
- 8869570000
- Manufacturer:
- Weidmuller
- Paglalarawan:
- SRC-I CLIP HM
- Lead Free Status / Katayuan ng RoHS:
- Lead libre sa pamamagitan ng exemption / RoHS sang pamamagitan ng exemption
- Magagamit na Dami:
- 12256 Pieces
- Data sheet:
- 8869570000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 8869570000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 8869570000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Mismong: | Metal |
|---|---|
| serye: | SRC |
| Manufacturer Bilang Bahagi: | 8869570000 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | RCI Series |
| Ang pinalawak Paglalarawan: | Clip, Hold Down RCI Series |
| paglalarawan: | SRC-I CLIP HM |
| kulay: | - |
| accessory Type: | Clip, Hold Down |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 8869570000
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PT28800 | TE Connectivity Potter & Brumfield Relays | RETAINING CLIP METAL PT SERIES | Pagtatanong |
 |
8611000000 | Weidmuller | PLED 230 VAC RED | Pagtatanong |
 |
8869590000 | Weidmuller | RIM-I 2 6/24VDC | Pagtatanong |
 |
8869510000 | Weidmuller | SRC-I CLIP HP | Pagtatanong |
 |
8869500000 | Weidmuller | SRC-I 2CO P | Pagtatanong |
 |
R99-11 | Omron Automation and Safety | MOUNTING BRACKET FOR G3NA RELAY | Pagtatanong |
 |
1860211-1 | TE Connectivity Potter & Brumfield Relays | RELAY ACCESSORIES | Pagtatanong |
 |
8869520000 | Weidmuller | SRC-I CLIP LP | Pagtatanong |
 |
8869580000 | Weidmuller | RIM-I 1 6/230V | Pagtatanong |
 |
8869530000 | Weidmuller | SRC-I MARK | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers