Bumili AB3X2X3W sa BYCHPS
Bumili na may garantiya
AB3X2X3W
- Numero ng Bahagi:
- AB3X2X3W
- Manufacturer:
- Toshiba Semiconductor
- Paglalarawan:
- FERRITE CORE SOLID 1.5MM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12418 Pieces
- Data sheet:
- AB3X2X3W.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AB3X2X3W, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AB3X2X3W sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Round |
|---|---|
| serye: | Amobeads® |
| Ratings: | - |
| Outer Dimensyon: | 0.157" Dia (4.00mm) |
| Salalayan Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| materyal: | - |
| Tagagawa Standard Lead Time: | 9 Weeks |
| Manufacturer Bilang Bahagi: | AB3X2X3W |
| Haba: | 0.177" (4.50mm) |
| Inner Dimensyon: | 0.059" Dia (1.50mm) |
| Impedance @ Frequency: | - |
| Ang pinalawak Paglalarawan: | Solid Free Hanging Ferrite Core ID 0.059" Dia (1.50mm) OD 0.157" Dia (4.00mm) Length 0.177" (4.50mm) |
| disenyo: | Solid |
| paglalarawan: | FERRITE CORE SOLID 1.5MM |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AB3X2X3W
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
ZCAT2035-0930A-BK | TDK Corporation | FERRITE CORE 100 OHM HINGED 9MM | Pagtatanong |
 |
74270024 | Wurth Electronics Inc. | FERRITE CORE 119 OHM SOLID | Pagtatanong |
 |
AB3X2X4.5DY | Toshiba Semiconductor and Storage | FERRITE CORE SOLID | Pagtatanong |
 |
AB3X2X6W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Pagtatanong |
 |
FB73-110-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Pagtatanong |
 |
AB3X2X4.5W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Pagtatanong |
 |
28A3851-0A2 | Laird-Signal Integrity Products | FERRITE CORE 260 OHM HINGED 13MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers