Bumili ADG858BCPZ-REEL7 sa BYCHPS
Bumili na may garantiya
ADG858BCPZ-REEL7
- Numero ng Bahagi:
- ADG858BCPZ-REEL7
- Manufacturer:
- AD
- Paglalarawan:
- IC SWITCH QUAD SPDT 16LFCSP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16540 Pieces
- Data sheet:
- ADG858BCPZ-REEL7.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ADG858BCPZ-REEL7, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ADG858BCPZ-REEL7 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Single (V +): | 1.8 V ~ 5.5 V |
|---|---|
| Boltahe - Supply, Dual (V ±): | - |
| Lumipat Time (Ton, Toff) (Max): | 27ns, 12ns |
| lumipat Circuit: | SPDT |
| Supplier aparato Package: | 16-LFCSP-UQ (2.1x2.1) |
| serye: | - |
| packaging: | Original-Reel® |
| Package / Kaso: | 16-UFQFN, CSP |
| Ibang pangalan: | ADG858BCPZ-REEL7DKR |
| operating Temperature: | -40°C ~ 85°C (TA) |
| On-State Resistance (Max): | 720 mOhm |
| Bilang ng Circuits: | 2 |
| Multiplexer / Demultiplexer Circuit: | 2:2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | ADG858BCPZ-REEL7 |
| Ang pinalawak Paglalarawan: | 2 Circuit IC Switch 2:2 720 mOhm 16-LFCSP-UQ (2.1x2.1) |
| paglalarawan: | IC SWITCH QUAD SPDT 16LFCSP |
| Current - Tagas (IS (off)) (Max): | 10pA (Typ) |
| crosstalk: | -85dB @ 100kHz |
| charge Injection: | 45pC |
| Channel-to-Channel Matching (ΔRon): | 40 mOhm |
| Channel kapasidad (CS (off), CD (off)): | 25pF |
| 3dB Bandwidth: | 70MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ADG858BCPZ-REEL7
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers