Bumili ADUC7024BCPZ62-RL7 sa BYCHPS
Bumili na may garantiya
ADUC7024BCPZ62-RL7
- Numero ng Bahagi:
- ADUC7024BCPZ62-RL7
- Manufacturer:
- AD
- Paglalarawan:
- IC MCU 32BIT 62KB FLASH 64LFCSP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17243 Pieces
- Data sheet:
- ADUC7024BCPZ62-RL7.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ADUC7024BCPZ62-RL7, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ADUC7024BCPZ62-RL7 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2.7 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 64-LFCSP-VQ (9x9) |
| bilis: | 44MHz |
| serye: | MicroConverter® ADuC7xxx |
| RAM Size: | 2K x 32 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 62KB (31K x16) |
| Peripherals: | PLA, PWM, PSM, Temp Sensor, WDT |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 64-VFQFN Exposed Pad, CSP |
| Ibang pangalan: | ADUC7024BCPZ62-RL7-ND ADUC7024BCPZ62-RL7TR |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 125°C (TA) |
| Bilang ng I / O: | 30 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | ADUC7024BCPZ62-RL7 |
| Ang pinalawak Paglalarawan: | ARM7® MicroConverter® ADuC7xxx Microcontroller IC 16/32-Bit 44MHz 62KB (31K x16) FLASH 64-LFCSP-VQ (9x9) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT 62KB FLASH 64LFCSP |
| data Converters: | A/D 10x12b; D/A 2x12b |
| core Size: | 16/32-Bit |
| core Processor: | ARM7® |
| Connectivity: | EBI/EMI, I²C, SPI, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ADUC7024BCPZ62-RL7
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers