Bumili AFE2124E/1KG4 sa BYCHPS
Bumili na may garantiya
AFE2124E/1KG4
- Numero ng Bahagi:
- AFE2124E/1KG4
- Manufacturer:
- Paglalarawan:
- IC DUAL ANALOG FRONT END 48-SSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18781 Pieces
- Data sheet:
- AFE2124E/1KG4.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AFE2124E/1KG4, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AFE2124E/1KG4 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Digital: | 3.15 V ~ 5.25 V |
|---|---|
| Boltahe - Supply, Analog: | 5V |
| Supplier aparato Package: | 48-SSOP |
| serye: | - |
| Power (Watts): | 250mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 48-BSSOP (0.295", 7.50mm Width) |
| Bilang ng mga Channels: | 1 |
| Bilang ng mga Bits: | 14 |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Bilang Bahagi: | AFE2124E/1KG4 |
| Ang pinalawak Paglalarawan: | 1 Channel AFE 14 Bit 250mW 48-SSOP |
| paglalarawan: | IC DUAL ANALOG FRONT END 48-SSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AFE2124E/1KG4
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
|
AFE2124E/1K | Texas Instruments | IC DUAL ANALOG FRONT END 48SSOP | Pagtatanong |
|
AFE2124EG4 | Texas Instruments | IC DUAL ANALOG FRONT END 48-SSOP | Pagtatanong |
|
AFE2124E | Texas Instruments | IC DUAL ANALOG FRONT END 48SSOP | Pagtatanong |
 |
MAX1101CWG+T | Maxim Integrated | IC CCD DIGITIZER 8BIT 24-SOIC | Pagtatanong |
|
VSP01M01ZWD | Texas Instruments | IC AFE 10BIT 36MHZ 100BGA | Pagtatanong |
 |
73M1903-IVT/F | Maxim Integrated | IC MODEM AFE V.22BIS 20-TSSOP | Pagtatanong |
|
ADAS1000BSTZ-RL | Analog Devices Inc. | IC AFE 19BIT 5CH 64LQFP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers