Bumili AFT09S200W02SR3 sa BYCHPS
Bumili na may garantiya
AFT09S200W02SR3
- Numero ng Bahagi:
- AFT09S200W02SR3
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- TRANSISTOR RF LDMOS 4W PLD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12537 Pieces
- Data sheet:
- AFT09S200W02SR3.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AFT09S200W02SR3, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AFT09S200W02SR3 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Ibang pangalan: | 935318364128 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | AFT09S200W02SR3 |
| Ang pinalawak Paglalarawan: | RF Mosfet |
| paglalarawan: | TRANSISTOR RF LDMOS 4W PLD |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AFT09S200W02SR3
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
AFT09S200W02NR3 | NXP USA Inc. | FET RF 70V 960MHZ PLD | Pagtatanong |
 |
AFT09MP055GNR1 | NXP USA Inc. | FET RF 2CH 40V 870MHZ TO-270 | Pagtatanong |
|
AFT09S282NR3 | NXP USA Inc. | FET RF 70V 960MHZ OM-780-2 | Pagtatanong |
|
AFT09S200W02GNR3 | NXP USA Inc. | FET RF 70V 960MHZ PLD | Pagtatanong |
|
AFT09MS031GNR1 | NXP USA Inc. | FET RF 40V 870MHZ TO270-2G | Pagtatanong |
 |
AFT09MP055NR1 | NXP USA Inc. | FET RF 2CH 40V 870MHZ TO-270 | Pagtatanong |
 |
AFT09MS007NT1 | NXP USA Inc. | FET RF 30V 870MHZ PLD1.5W | Pagtatanong |
|
AFT09H310-03SR6 | NXP USA Inc. | FET RF 2CH 70V 920MHZ NI1230S-4S | Pagtatanong |
|
AFT09S220-02NR3 | NXP USA Inc. | IC TRANS RF LDMOS | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers