Bumili AS4C256M16D3L-12BIN sa BYCHPS
Bumili na may garantiya
AS4C256M16D3L-12BIN
- Numero ng Bahagi:
- AS4C256M16D3L-12BIN
- Manufacturer:
- Alliance Memory, Inc.
- Paglalarawan:
- IC SDRAM 4GBIT 800MHZ 96BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 20402 Pieces
- Data sheet:
- AS4C256M16D3L-12BIN.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AS4C256M16D3L-12BIN, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AS4C256M16D3L-12BIN sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.283 V ~ 1.45 V |
|---|---|
| Supplier aparato Package: | 96-FBGA (13x9) |
| bilis: | 800MHz |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 96-TFBGA |
| Ibang pangalan: | 1450-1098 |
| operating Temperature: | -40°C ~ 95°C (TC) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Type memory: | Volatile |
| Size memory: | 4Gb (256M x 16) |
| memory Format: | DRAM |
| Manufacturer Bilang Bahagi: | AS4C256M16D3L-12BIN |
| interface: | Parallel |
| paglalarawan: | IC SDRAM 4GBIT 800MHZ 96BGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AS4C256M16D3L-12BIN
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers