Bumili AS8515-ZMFP sa BYCHPS
Bumili na may garantiya
AS8515-ZMFP
- Numero ng Bahagi:
- AS8515-ZMFP
- Manufacturer:
- ams
- Paglalarawan:
- IC TXRX DAC LIN 32MLF
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13967 Pieces
- Data sheet:
- AS8515-ZMFP.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AS8515-ZMFP, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AS8515-ZMFP sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Data Acquisition |
|---|---|
| Supplier aparato Package: | 32-MLP (5x5) |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 32-VFQFN Exposed Pad |
| Type output: | - |
| Ibang pangalan: | 183200034 183200042 |
| operating Temperature: | -40°C ~ 115°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | AS8515-ZMFP |
| interface: | 4-Wire Serial |
| Type input: | - |
| paglalarawan: | IC TXRX DAC LIN 32MLF |
| Current - Supply: | 27mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AS8515-ZMFP
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
1B22AN | Analog Devices Inc. | IC VOLTAGE CONVERTER PROG DIP | Pagtatanong |
 |
BU21051FS-E2 | Rohm Semiconductor | IC CAP SENSOR SWITCH 8CH 16-SSOP | Pagtatanong |
 |
AS8515-ZMFM | ams | IC BATTERY MANAGEMENT | Pagtatanong |
 |
ADM1022ARQZ-REEL7 | ON Semiconductor | IC SENSOR TEMP/DET 3/5.5V 16QSOP | Pagtatanong |
 |
AS8510-ASSM | ams | IC BATTERY MANAGEMENT 20-SSOP | Pagtatanong |
|
AS8510-ASSP | ams | IC BATTERY MANAGEMENT 20-SSOP | Pagtatanong |
 |
SX8724SWLTDT | Semtech Corporation | IC DAS ZOOM ADC 3INP SPI 16MLPQ | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers