Bumili B1010-2R5155 sa BYCHPS
Bumili na may garantiya
B1010-2R5155
- Numero ng Bahagi:
- B1010-2R5155
- Manufacturer:
- Bussmann (Eaton)
- Paglalarawan:
- CAP 1.5F -20% +80% 2.5V T/H
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16875 Pieces
- Data sheet:
- B1010-2R5155.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa B1010-2R5155, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa B1010-2R5155 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 2.5V |
|---|---|
| pagpapaubaya: | -20%, +80% |
| pagwawakas: | Through Hole |
| Sukat / Dimension: | 0.413" Dia (10.50mm) |
| serye: | PowerStor B |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can |
| Ibang pangalan: | 283-2503 526-2503 526-2503-ND |
| operating Temperature: | -25°C ~ 70°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | B1010-2R5155 |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Taas - Makaupo (Max): | 0.583" (14.80mm) |
| Ang pinalawak Paglalarawan: | 1.5F -20%, +80%(EDLC) Supercapacitor 2.5V Radial, Can 300 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Katumbas Series pagtutol): | 300 mOhm @ 1kHz |
| paglalarawan: | CAP 1.5F -20% +80% 2.5V T/H |
| kapasidad: | 1.5F |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa B1010-2R5155
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
B1010-2R5155-R | Eaton | CAP 1.5F -20% +80% 2.5V T/H | Pagtatanong |
 |
MAL219691123E3 | Vishay BC Components | CAP ALUM 4F 4.2V SNAP | Pagtatanong |
|
MAL219691112E3 | Vishay BC Components | CAP ALUM 4F 2.8V SNAP | Pagtatanong |
 |
FE0H155ZF | KEMET | CAP 1.5F -20% +80% 5.5V T/H | Pagtatanong |
 |
B1635-2R5226 | Eaton | CAP 22F -20% +80% 2.5V T/H | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers