Bumili BAS28E6327HTSA1 sa BYCHPS
Bumili na may garantiya
BAS28E6327HTSA1
- Numero ng Bahagi:
- BAS28E6327HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- DIODE ARRAY GP 80V 200MA SOT143
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18126 Pieces
- Data sheet:
- BAS28E6327HTSA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BAS28E6327HTSA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BAS28E6327HTSA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.25V @ 150mA |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 80V |
| Supplier aparato Package: | PG-SOT143-4 |
| bilis: | Small Signal =< 200mA (Io), Any Speed |
| serye: | - |
| Reverse Recovery Time (trr): | 4ns |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | TO-253-4, TO-253AA |
| Ibang pangalan: | BAS 28 E6327 BAS 28 E6327-ND BAS 28 E6327TR-ND BAS28E6327 BAS28E6327BTSA1 BAS28E6327XT SP000010225 |
| Operating Temperature - Junction: | 150°C (Max) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BAS28E6327HTSA1 |
| Ang pinalawak Paglalarawan: | Diode Array 2 Independent Standard 80V 200mA (DC) Surface Mount TO-253-4, TO-253AA |
| Type diode: | Standard |
| diode Configuration: | 2 Independent |
| paglalarawan: | DIODE ARRAY GP 80V 200MA SOT143 |
| Current - Reverse pagtagas @ Vr: | 100nA @ 75V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 200mA (DC) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BAS28E6327HTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers