Bumili BF247A_J35Z sa BYCHPS
Bumili na may garantiya
BF247A_J35Z
- Numero ng Bahagi:
- BF247A_J35Z
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- JFET N-CH 25V 0.35W TO92
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19555 Pieces
- Data sheet:
- BF247A_J35Z.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BF247A_J35Z, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BF247A_J35Z sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Cutoff (VGS off) @ Id: | 600mV @ 100nA |
|---|---|
| Boltahe - Breakdown (V (BR) GSS): | 25V |
| Supplier aparato Package: | TO-92-3 |
| serye: | - |
| Paglaban - RDS (On): | - |
| Power - Max: | 350mW |
| packaging: | Bulk |
| Package / Kaso: | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BF247A_J35Z |
| Input Kapasidad (Ciss) (Max) @ Vds: | - |
| Type FET: | N-Channel |
| Ang pinalawak Paglalarawan: | JFET N-Channel 30mA @ 15V 350mW Through Hole TO-92-3 |
| Alisan ng tubig sa Source Boltahe (Vdss): | - |
| paglalarawan: | JFET N-CH 25V 0.35W TO92 |
| Current - Drain (Idss) @ Vds (Vgs = 0): | 30mA @ 15V |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BF247A_J35Z
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BF247A | Fairchild/ON Semiconductor | JFET N-CH 25V 0.35W TO92 | Pagtatanong |
 |
BSR56,215 | NXP USA Inc. | JFET N-CH 40V 0.25W SOT23 | Pagtatanong |
 |
2SK2593GQL | Panasonic Electronic Components | JFET N-CH 30MA 125MW SSMINI-3 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers