Bumili BSB028N06NN3 G sa BYCHPS
Bumili na may garantiya
BSB028N06NN3 G
- Numero ng Bahagi:
- BSB028N06NN3 G
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- MOSFET N-CH 60V 22A WDSON-2
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13032 Pieces
- Data sheet:
- BSB028N06NN3 G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BSB028N06NN3 G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BSB028N06NN3 G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 4V @ 102µA |
|---|---|
| Vgs (Max): | ±20V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | MG-WDSON-2, CanPAK M™ |
| serye: | OptiMOS™ |
| Rds On (Max) @ Id, Vgs: | 2.8 mOhm @ 30A, 10V |
| Power pagwawaldas (Max): | 2.2W (Ta), 78W (Tc) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 3-WDSON |
| Ibang pangalan: | BSB028N06NN3 G-ND BSB028N06NN3G BSB028N06NN3GXUMA1 SP000605956 |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | BSB028N06NN3 G |
| Input Kapasidad (Ciss) (Max) @ Vds: | 12000pF @ 30V |
| Gate Charge (Qg) (Max) @ Vgs: | 143nC @ 10V |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 60V 22A (Ta), 90A (Tc) 2.2W (Ta), 78W (Tc) Surface Mount MG-WDSON-2, CanPAK M™ |
| Drive Boltahe (Max Rds On, Min Rds On): | 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 60V |
| paglalarawan: | MOSFET N-CH 60V 22A WDSON-2 |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 22A (Ta), 90A (Tc) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BSB028N06NN3 G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog