Bumili BSM300GA170DN2HOSA1 sa BYCHPS
Bumili na may garantiya
BSM300GA170DN2HOSA1
- Numero ng Bahagi:
- BSM300GA170DN2HOSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- MODULE IGBT 1700V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12380 Pieces
- Data sheet:
- BSM300GA170DN2HOSA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BSM300GA170DN2HOSA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BSM300GA170DN2HOSA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 1700V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 3.9V @ 15V, 300A |
| Supplier aparato Package: | Module |
| serye: | - |
| Power - Max: | 2500W |
| Package / Kaso: | Module |
| Ibang pangalan: | SP000100754 |
| operating Temperature: | 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BSM300GA170DN2HOSA1 |
| input: | Standard |
| Type IGBT: | - |
| Ang pinalawak Paglalarawan: | IGBT Module Single 1700V 440A 2500W Chassis Mount Module |
| paglalarawan: | MODULE IGBT 1700V |
| Current - Kolektor Cutoff (Max): | 3mA |
| Current - kolektor (Ic) (Max): | 440A |
| configuration: | Single |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BSM300GA170DN2HOSA1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
APTGF300U120DG | Microsemi Corporation | IGBT 1200V 400A 1780W SP6 | Pagtatanong |
 |
MKI65-06A7T | IXYS | IGBT H-BRIDGE 600V E2PACK | Pagtatanong |
 |
CM50BU-24H | Powerex Inc. | IGBT MOD H-BRDG 1200V 50A U SER | Pagtatanong |
|
CM500HA-34A | Powerex Inc. | IGBT MOD SGL 1700V 500A A SER | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog