Bumili BSO130P03S H sa BYCHPS
Bumili na may garantiya
BSO130P03S H
- Numero ng Bahagi:
- BSO130P03S H
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- MOSFET P-CH 30V 9.2A 8DSO
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19984 Pieces
- Data sheet:
- BSO130P03S H.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BSO130P03S H, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BSO130P03S H sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2.2V @ 140µA |
|---|---|
| Vgs (Max): | ±25V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | P-DSO-8 |
| serye: | OptiMOS™ |
| Rds On (Max) @ Id, Vgs: | 13 mOhm @ 11.7A, 10V |
| Power pagwawaldas (Max): | 1.56W (Ta) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-SOIC (0.154", 3.90mm Width) |
| Ibang pangalan: | BSO130P03S H-ND BSO130P03SH BSO130P03SHXUMA1 SP000613860 |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | BSO130P03S H |
| Input Kapasidad (Ciss) (Max) @ Vds: | 3520pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 81nC @ 10V |
| Type FET: | P-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | P-Channel 30V 9.2A (Ta) 1.56W (Ta) Surface Mount P-DSO-8 |
| Drive Boltahe (Max Rds On, Min Rds On): | 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 30V |
| paglalarawan: | MOSFET P-CH 30V 9.2A 8DSO |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 9.2A (Ta) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BSO130P03S H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers