Bumili BSP300H6327XUSA1 sa BYCHPS
Bumili na may garantiya
BSP300H6327XUSA1
- Numero ng Bahagi:
- BSP300H6327XUSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- MOSFET N-CH 800V 190MA SOT-223
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14253 Pieces
- Data sheet:
- BSP300H6327XUSA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BSP300H6327XUSA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BSP300H6327XUSA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 4V @ 1mA |
|---|---|
| Vgs (Max): | ±20V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | PG-SOT223-4 |
| serye: | SIPMOS® |
| Rds On (Max) @ Id, Vgs: | 20 Ohm @ 190mA, 10V |
| Power pagwawaldas (Max): | 1.8W (Ta) |
| packaging: | Original-Reel® |
| Package / Kaso: | TO-261-4, TO-261AA |
| Ibang pangalan: | BSP300H6327XUSA1DKR |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | BSP300H6327XUSA1 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 230pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | - |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 800V 190mA (Ta) 1.8W (Ta) Surface Mount PG-SOT223-4 |
| Drive Boltahe (Max Rds On, Min Rds On): | 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 800V |
| paglalarawan: | MOSFET N-CH 800V 190MA SOT-223 |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 190mA (Ta) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BSP300H6327XUSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers