Bumili BUK9Y22-30B,115 sa BYCHPS
Bumili na may garantiya
BUK9Y22-30B,115
- Numero ng Bahagi:
- BUK9Y22-30B,115
- Manufacturer:
- Nexperia
- Paglalarawan:
- MOSFET N-CH 30V 37.7A LFPAK
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18899 Pieces
- Data sheet:
- BUK9Y22-30B,115.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BUK9Y22-30B,115, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BUK9Y22-30B,115 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2V @ 1mA |
|---|---|
| Vgs (Max): | ±15V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | LFPAK56, Power-SO8 |
| serye: | Automotive, AEC-Q101, TrenchMOS™ |
| Rds On (Max) @ Id, Vgs: | 19 mOhm @ 20A, 10V |
| Power pagwawaldas (Max): | 59.4W (Tc) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SC-100, SOT-669 |
| Ibang pangalan: | 1727-4615-2 568-5527-2 568-5527-2-ND 934063319115 BUK9Y2230B115 |
| operating Temperature: | -55°C ~ 175°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | BUK9Y22-30B,115 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 940pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 10.5nC @ 5V |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 30V 37.7A (Tc) 59.4W (Tc) Surface Mount LFPAK56, Power-SO8 |
| Drive Boltahe (Max Rds On, Min Rds On): | 5V, 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 30V |
| paglalarawan: | MOSFET N-CH 30V 37.7A LFPAK |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 37.7A (Tc) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BUK9Y22-30B,115
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers