Bumili BYM13-30HE3/97 sa BYCHPS
Bumili na may garantiya
BYM13-30HE3/97
- Numero ng Bahagi:
- BYM13-30HE3/97
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- DIODE SCHOTTKY 30V 1A DO213AB
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14292 Pieces
- Data sheet:
- 1.BYM13-30HE3/97.pdf2.BYM13-30HE3/97.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BYM13-30HE3/97, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BYM13-30HE3/97 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 500mV @ 1A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 30V |
| Supplier aparato Package: | DO-213AB |
| bilis: | Fast Recovery = 200mA (Io) |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | DO-213AB, MELF |
| Operating Temperature - Junction: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | BYM13-30HE3/97 |
| Ang pinalawak Paglalarawan: | Diode Schottky 30V 1A Surface Mount DO-213AB |
| Type diode: | Schottky |
| paglalarawan: | DIODE SCHOTTKY 30V 1A DO213AB |
| Current - Reverse pagtagas @ Vr: | 500µA @ 30V |
| Kasalukuyang - Average rectified (Io): | 1A |
| Kapasidad @ Vr, F: | 110pF @ 4V, 1MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BYM13-30HE3/97
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers