Bumili BYV32EB-200,118 sa BYCHPS
Bumili na may garantiya
BYV32EB-200,118
- Numero ng Bahagi:
- BYV32EB-200,118
- Manufacturer:
- WeEn Semiconductors Co., Ltd
- Paglalarawan:
- DIODE ARRAY GP 200V 20A D2PAK
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16461 Pieces
- Data sheet:
- BYV32EB-200,118.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BYV32EB-200,118, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BYV32EB-200,118 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.15V @ 20A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 200V |
| Supplier aparato Package: | D2PAK |
| bilis: | Fast Recovery = 200mA (Io) |
| serye: | - |
| Reverse Recovery Time (trr): | 25ns |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Ibang pangalan: | 1740-1170-2 568-3436-2 568-3436-2-ND 934041010118 BYV32EB-200 /T3 |
| Operating Temperature - Junction: | 150°C (Max) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | BYV32EB-200,118 |
| Ang pinalawak Paglalarawan: | Diode Array 1 Pair Common Cathode Standard 200V 20A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Type diode: | Standard |
| diode Configuration: | 1 Pair Common Cathode |
| paglalarawan: | DIODE ARRAY GP 200V 20A D2PAK |
| Current - Reverse pagtagas @ Vr: | 30µA @ 200V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 20A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BYV32EB-200,118
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers