Bumili C3225X5R1C106M/5 sa BYCHPS
Bumili na may garantiya
C3225X5R1C106M/5
- Numero ng Bahagi:
- C3225X5R1C106M/5
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CAP CER 10UF 16V X5R 1210
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16536 Pieces
- Data sheet:
- 1.C3225X5R1C106M/5.pdf2.C3225X5R1C106M/5.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa C3225X5R1C106M/5, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa C3225X5R1C106M/5 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 16V |
|---|---|
| pagpapaubaya: | ±20% |
| Kapal (Max): | 0.087" (2.20mm) |
| temperatura koepisyent: | X5R |
| Sukat / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| serye: | C |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1210 (3225 Metric) |
| Ibang pangalan: | C3225X5R1C106MT/5 C3225X5R1C106MT/5-ND |
| operating Temperature: | -55°C ~ 85°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | C3225X5R1C106M/5 |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 10µF ±20% 16V Ceramic Capacitor X5R 1210 (3225 Metric) |
| paglalarawan: | CAP CER 10UF 16V X5R 1210 |
| kapasidad: | 10µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa C3225X5R1C106M/5
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers