Bumili CA91C142D-33IEV sa BYCHPS
Bumili na may garantiya
CA91C142D-33IEV
- Numero ng Bahagi:
- CA91C142D-33IEV
- Manufacturer:
- IDT (Integrated Device Technology)
- Paglalarawan:
- IC PCI-VME BRIDGE 313BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12757 Pieces
- Data sheet:
- 1.CA91C142D-33IEV.pdf2.CA91C142D-33IEV.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CA91C142D-33IEV, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CA91C142D-33IEV sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 5V |
|---|---|
| Supplier aparato Package: | 313-PBGA (35x35) |
| serye: | Universe IID™ |
| packaging: | Tray |
| Package / Kaso: | 313-BGA |
| Ibang pangalan: | IDTCA91C142D-33IEV IDTCA91C142D-33IEV-ND |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | CA91C142D-33IEV |
| interface: | PCI |
| Ang pinalawak Paglalarawan: | Telecommunications Interface 313-PBGA (35x35) |
| paglalarawan: | IC PCI-VME BRIDGE 313BGA |
| aplikasyon: | Telecommunications |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CA91C142D-33IEV
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
CA91C142D-33CE | IDT, Integrated Device Technology Inc | IC PCI-VME BRIDGE 313BGA | Pagtatanong |
|
CA91C142D-33CEV | IDT, Integrated Device Technology Inc | IC PCI-VME BRIDGE 313BGA | Pagtatanong |
|
CA91C142D-33IE | IDT, Integrated Device Technology Inc | IC PCI-VME BRIDGE 313BGA | Pagtatanong |
|
CA91C142D-25EE | IDT, Integrated Device Technology Inc | IC VME TO PCI BRIDGE 313BGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers