Bumili CB018B0182GBA sa BYCHPS
Bumili na may garantiya
CB018B0182GBA
- Numero ng Bahagi:
- CB018B0182GBA
- Manufacturer:
- AVX Corporation
- Paglalarawan:
- CAP FILM 1800PF 2% 16VDC 1206
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14763 Pieces
- Data sheet:
- CB018B0182GBA.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CB018B0182GBA, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CB018B0182GBA sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | 16V |
|---|---|
| Boltahe Rating - AC: | 10V |
| pagpapaubaya: | ±2% |
| pagwawakas: | Solder Pads |
| Sukat / Dimension: | 0.130" L x 0.063" W (3.30mm x 1.60mm) |
| serye: | CB |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric) |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 29 Weeks |
| Manufacturer Bilang Bahagi: | CB018B0182GBA |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | 0.045" (1.15mm) |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 1800pF ±2% Film Capacitor 10V 16V Polyphenylene Sulfide (PPS), Metallized - Stacked 1206 (3216 Metric) |
| ESR (Katumbas Series pagtutol): | - |
| dielectric Material: | Polyphenylene Sulfide (PPS), Metallized - Stacked |
| paglalarawan: | CAP FILM 1800PF 2% 16VDC 1206 |
| kapasidad: | 1800pF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CB018B0182GBA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers