Bumili CGA6P1X7S3D222K250AA sa BYCHPS
Bumili na may garantiya
CGA6P1X7S3D222K250AA
- Numero ng Bahagi:
- CGA6P1X7S3D222K250AA
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CAP CER 2200PF 2KV X7S 1210
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12586 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CGA6P1X7S3D222K250AA, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CGA6P1X7S3D222K250AA sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 2000V (2kV) |
|---|---|
| pagpapaubaya: | ±10% |
| Kapal (Max): | 0.110" (2.80mm) |
| temperatura koepisyent: | X7S |
| Sukat / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| serye: | CGA |
| Ratings: | AEC-Q200 |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1210 (3225 Metric) |
| Ibang pangalan: | 445-13040-2 CGA6P1X7S3D222KT0Y0N |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | CGA6P1X7S3D222K250AA |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 2200pF ±10% 2000V (2kV) Ceramic Capacitor X7S 1210 (3225 Metric) |
| paglalarawan: | CAP CER 2200PF 2KV X7S 1210 |
| kapasidad: | 2200pF |
| aplikasyon: | Automotive |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CGA6P1X7S3D222K250AA
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
CGA6P1X7R1C226M250AC | TDK Corporation | CAP CER 22UF 16V X7R 1210 | Pagtatanong |
|
CGA6P1X7S3D222M250AA | TDK Corporation | CAP CER 2200PF 2KV X7S 1210 | Pagtatanong |
 |
CGA6P1X8R1E106K250AD | TDK Corporation | CAP CER 10UF 25V X8R 1210 | Pagtatanong |
|
CGA6P1C0G3A103J250AC | TDK Corporation | CAP CER 10000PF 1KV NP0 1210 | Pagtatanong |
|
CGA6P1X7R1E106M250AC | TDK Corporation | CAP CER 10UF 25V X7R 1210 | Pagtatanong |
|
CGA6P1X7R1E106K250AC | TDK Corporation | CAP CER 10UF 25V X7R 1210 | Pagtatanong |
|
CGA6P1X7S0J336M250AC | TDK Corporation | CAP CER 33UF 6.3V X7S 1210 | Pagtatanong |
|
CGA6P1C0G3A153J250AC | TDK Corporation | CAP CER 0.015UF 1KV NP0 1210 | Pagtatanong |
|
CGA6P1X8R1E106K250AC | TDK Corporation | CAP CER 10UF 25V X8R 1210 | Pagtatanong |
|
CGA6P1X8R1E106K250AE | TDK Corporation | CAP CER 10UF 25V X8R 1210 | Pagtatanong |
|
CGA6P1C0G3A223J250AC | TDK Corporation | CAP CER 0.022UF 1KV NP0 1210 | Pagtatanong |
|
CGA6P1X7S0J476M250AC | TDK Corporation | CAP CER 47UF 6.3V X7S 1210 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers