Bumili CK45-R3AD331KANRA sa BYCHPS
Bumili na may garantiya
CK45-R3AD331KANRA
- Numero ng Bahagi:
- CK45-R3AD331KANRA
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CAP CER 330PF 1KV RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12306 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CK45-R3AD331KANRA, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CK45-R3AD331KANRA sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 1000V (1kV) |
|---|---|
| pagpapaubaya: | ±10% |
| Kapal (Max): | - |
| temperatura koepisyent: | R |
| Sukat / Dimension: | 0.295" Dia (7.50mm) |
| serye: | CK45-RR |
| Ratings: | AEC-Q200 |
| packaging: | Bulk |
| Package / Kaso: | Radial, Disc |
| Ibang pangalan: | 445-15883 |
| operating Temperature: | -25°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | CK45-R3AD331KANRA |
| Lead Style: | Straight |
| Lead Spacing: | 0.197" (5.00mm) |
| Taas - Makaupo (Max): | 0.453" (11.50mm) |
| Mga tampok: | High Voltage, Low Dissipation Factor |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 330pF ±10% 1000V (1kV) Ceramic Capacitor R Radial, Disc |
| paglalarawan: | CAP CER 330PF 1KV RADIAL |
| kapasidad: | 330pF |
| aplikasyon: | Automotive |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CK45-R3AD331KANRA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers