Bumili CL02C330JO2ANNC sa BYCHPS
Bumili na may garantiya
CL02C330JO2ANNC
- Numero ng Bahagi:
- CL02C330JO2ANNC
- Manufacturer:
- Samsung Electro-Mechanics America, Inc.
- Paglalarawan:
- CAP CER 33PF 16V C0G/NP0 01005
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15272 Pieces
- Data sheet:
- 1.CL02C330JO2ANNC.pdf2.CL02C330JO2ANNC.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CL02C330JO2ANNC, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CL02C330JO2ANNC sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 16V |
|---|---|
| pagpapaubaya: | ±5% |
| Kapal (Max): | 0.009" (0.22mm) |
| temperatura koepisyent: | C0G, NP0 |
| Sukat / Dimension: | 0.016" L x 0.008" W (0.40mm x 0.20mm) |
| serye: | CL |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 01005 (0402 Metric) |
| Ibang pangalan: | 1276-1226-2 |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | CL02C330JO2ANNC |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 33pF ±5% 16V Ceramic Capacitor C0G, NP0 01005 (0402 Metric) |
| paglalarawan: | CAP CER 33PF 16V C0G/NP0 01005 |
| kapasidad: | 33pF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CL02C330JO2ANNC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers