Bumili CP3SP33SMSX/NOPB sa BYCHPS
Bumili na may garantiya
CP3SP33SMSX/NOPB
- Numero ng Bahagi:
- CP3SP33SMSX/NOPB
- Manufacturer:
- Paglalarawan:
- IC CPU W/BLUTOOTH&CAN 224NFBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16696 Pieces
- Data sheet:
- CP3SP33SMSX/NOPB.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CP3SP33SMSX/NOPB, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CP3SP33SMSX/NOPB sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3 V ~ 3.3 V |
|---|---|
| Supplier aparato Package: | 224-NFBGA |
| serye: | - |
| RAM Size: | 44K x 8 |
| Type Program Memory: | External Program Memory |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 224-LFBGA |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng I / O: | 64 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 33 Weeks |
| Manufacturer Bilang Bahagi: | CP3SP33SMSX/NOPB |
| interface: | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I²S, Microwire/SPI, UART/USART, USB OTG |
| paglalarawan: | IC CPU W/BLUTOOTH&CAN 224NFBGA |
| core Processor: | CR16C |
| controller Series: | CP3000 |
| aplikasyon: | Connectivity Processor |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CP3SP33SMSX/NOPB
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
|
CP3SP33SMRX/NOPB | Texas Instruments | IC CPU W/BLUTOOTH&CAN 144-BGA | Pagtatanong |
 |
ELCS3516C.A3-998836 | Inphi Corporation | IC NETWORK PROCESS COMM 400BGA | Pagtatanong |
|
CP3SP33SMS/NOPB | Texas Instruments | IC CPU W/BLUTOOTH&CAN 224NFBGA | Pagtatanong |
|
CP3SP33SMR/NOPB | Texas Instruments | IC CPU W/BLUTOOTH&CAN 144-BGA | Pagtatanong |
|
MSP430TCH5EPW | Texas Instruments | IC MCU 16BIT | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog