Bumili CPV363M4U sa BYCHPS
Bumili na may garantiya
CPV363M4U
- Numero ng Bahagi:
- CPV363M4U
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- IGBT SIP MODULE 600V 6.8A IMS-2
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 17255 Pieces
- Data sheet:
- CPV363M4U.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa CPV363M4U, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa CPV363M4U sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 2V @ 15V, 13A |
| Supplier aparato Package: | IMS-2 |
| serye: | - |
| Power - Max: | 36W |
| Package / Kaso: | 19-SIP (13 Leads), IMS-2 |
| Ibang pangalan: | *CPV363M4U VS-CPV363M4U VS-CPV363M4U-ND VSCPV363M4U VSCPV363M4U-ND |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | CPV363M4U |
| Input Kapasidad (CIEs) @ Vce: | 1.1nF @ 30V |
| input: | Standard |
| Type IGBT: | - |
| Ang pinalawak Paglalarawan: | IGBT Module Three Phase Inverter 600V 13A 36W Through Hole IMS-2 |
| paglalarawan: | IGBT SIP MODULE 600V 6.8A IMS-2 |
| Current - Kolektor Cutoff (Max): | 250µA |
| Current - kolektor (Ic) (Max): | 13A |
| configuration: | Three Phase Inverter |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa CPV363M4U
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers