Bumili DF38327WV sa BYCHPS
Bumili na may garantiya
DF38327WV
- Numero ng Bahagi:
- DF38327WV
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IC MCU 8BIT 60KB FLASH 80TQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15017 Pieces
- Data sheet:
- DF38327WV.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DF38327WV, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DF38327WV sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2.7 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 80-TQFP (12x12) |
| bilis: | 8MHz |
| serye: | H8® H8/300L SLP |
| RAM Size: | 2K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 60KB (60K x 8) |
| Peripherals: | LCD, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 80-TQFP |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 55 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | DF38327WV |
| Ang pinalawak Paglalarawan: | H8/300L H8® H8/300L SLP Microcontroller IC 8-Bit 8MHz 60KB (60K x 8) FLASH 80-TQFP (12x12) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 8BIT 60KB FLASH 80TQFP |
| data Converters: | A/D 8x10b |
| core Size: | 8-Bit |
| core Processor: | H8/300L |
| Connectivity: | SCI |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DF38327WV
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers