Bumili DMN3008SFGQ-13 sa BYCHPS
Bumili na may garantiya
DMN3008SFGQ-13
- Numero ng Bahagi:
- DMN3008SFGQ-13
- Manufacturer:
- Diodes Incorporated
- Paglalarawan:
- MOSFET NCH 30V 17.6A POWERDI
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17647 Pieces
- Data sheet:
- DMN3008SFGQ-13.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DMN3008SFGQ-13, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DMN3008SFGQ-13 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2.3V @ 250µA |
|---|---|
| Supplier aparato Package: | PowerDI3333-8 |
| serye: | Automotive, AEC-Q101 |
| Rds On (Max) @ Id, Vgs: | 4.4 mOhm @ 13.5A, 10V |
| Power - Max: | 900mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-PowerVDFN |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | DMN3008SFGQ-13 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 3690pF @ 10V |
| Gate Charge (Qg) (Max) @ Vgs: | 86nC @ 10V |
| Type FET: | MOSFET N-Channel, Metal Oxide |
| FET Tampok: | Standard |
| Ang pinalawak Paglalarawan: | Mosfet Array MOSFET N-Channel, Metal Oxide 30V 17.6A (Ta), 62A (Tc) 900mW Surface Mount PowerDI3333-8 |
| Alisan ng tubig sa Source Boltahe (Vdss): | 30V |
| paglalarawan: | MOSFET NCH 30V 17.6A POWERDI |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 17.6A (Ta), 62A (Tc) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DMN3008SFGQ-13
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers