Bumili E32D3B1HPN392MDB7M sa BYCHPS
Bumili na may garantiya
E32D3B1HPN392MDB7M
- Numero ng Bahagi:
- E32D3B1HPN392MDB7M
- Manufacturer:
- Nippon Chemi-Con
- Paglalarawan:
- CAP ALUM 3900UF 20% 315V SCREW
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18335 Pieces
- Data sheet:
- E32D3B1HPN392MDB7M.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa E32D3B1HPN392MDB7M, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa E32D3B1HPN392MDB7M sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 315V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 2.500" Dia (63.50mm) |
| serye: | U32D |
| Ripple Kasalukuyang: | 10.63A @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can - Screw Terminals |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | E32D3B1HPN392MDB7M |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 1.125" (28.58mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 4.625" (117.48mm) |
| Ang pinalawak Paglalarawan: | 3900µF 315V Aluminum Capacitors Radial, Can - Screw Terminals 43.7 mOhm @ 120Hz 2000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 43.7 mOhm @ 120Hz |
| paglalarawan: | CAP ALUM 3900UF 20% 315V SCREW |
| kapasidad: | 3900µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa E32D3B1HPN392MDB7M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog