Bumili ECW-FE2J334JA sa BYCHPS
Bumili na may garantiya
ECW-FE2J334JA
- Numero ng Bahagi:
- ECW-FE2J334JA
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP FILM 0.33UF 5% 630VDC RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14653 Pieces
- Data sheet:
- 1.ECW-FE2J334JA.pdf2.ECW-FE2J334JA.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ECW-FE2J334JA, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ECW-FE2J334JA sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | 630V |
|---|---|
| Boltahe Rating - AC: | - |
| pagpapaubaya: | ±5% |
| pagwawakas: | PC Pins |
| Sukat / Dimension: | 0.689" L x 0.335" W (17.50mm x 8.50mm) |
| serye: | ECWFE |
| packaging: | Bulk |
| Package / Kaso: | Radial |
| Ibang pangalan: | ECWFE2J334JA |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | ECW-FE2J334JA |
| Lead Spacing: | 0.591" (15.00mm) |
| Taas - Makaupo (Max): | 0.571" (14.50mm) |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 0.33µF ±5% Film Capacitor 630V Polypropylene (PP), Metallized Radial |
| ESR (Katumbas Series pagtutol): | - |
| dielectric Material: | Polypropylene (PP), Metallized |
| paglalarawan: | CAP FILM 0.33UF 5% 630VDC RADIAL |
| kapasidad: | 0.33µF |
| aplikasyon: | EMI, RFI Suppression; High Frequency, Switching; High Pulse, DV/DT |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ECW-FE2J334JA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers