Bumili EEE-FPJ331XAP sa BYCHPS
Bumili na may garantiya
EEE-FPJ331XAP
- Numero ng Bahagi:
- EEE-FPJ331XAP
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP ALUM 330UF 20% 6.3V SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13004 Pieces
- Data sheet:
- 1.EEE-FPJ331XAP.pdf2.EEE-FPJ331XAP.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EEE-FPJ331XAP, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EEE-FPJ331XAP sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 6.3V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Sukat / Dimension: | 0.248" Dia (6.30mm) |
| serye: | Automotive, AEC-Q200, FP |
| Ripple Kasalukuyang: | 390mA @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Original-Reel® |
| Package / Kaso: | Radial, Can - SMD |
| Ibang pangalan: | PCE4517DKR |
| operating Temperature: | -55°C ~ 105°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | EEE-FPJ331XAP |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedance: | - |
| Taas - Makaupo (Max): | 0.303" (7.70mm) |
| Ang pinalawak Paglalarawan: | 330µF 6.3V Aluminum Capacitors Radial, Can - SMD 160 mohm @ 100kHz 2000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 160 mohm @ 100kHz |
| paglalarawan: | CAP ALUM 330UF 20% 6.3V SMD |
| kapasidad: | 330µF |
| aplikasyon: | Automotive |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EEE-FPJ331XAP
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog