Bumili EEF-UE0G331ER sa BYCHPS
Bumili na may garantiya
EEF-UE0G331ER
- Numero ng Bahagi:
- EEF-UE0G331ER
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP ALUM POLY 330UF 20% 4V SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12347 Pieces
- Data sheet:
- EEF-UE0G331ER.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EEF-UE0G331ER, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EEF-UE0G331ER sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 4V |
|---|---|
| uri: | Polymer |
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Sukat / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| serye: | SP-Cap UE |
| Ripple Kasalukuyang - Mababang Dalas: | - |
| Ripple Kasalukuyang - Mataas na Dalas: | 3.3A @ 100kHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 2917 (7343 Metric) |
| Ibang pangalan: | EEFUE0G331ER PCE4505TR |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | EEF-UE0G331ER |
| Lifetime @ Temp.: | 1000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedance: | - |
| Taas - Makaupo (Max): | 0.165" (4.20mm) |
| Ang pinalawak Paglalarawan: | 330µF ±20% 4V Aluminum Polymer Capacitor 2917 (7343 Metric) 12 mOhm 1000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 12 mOhm |
| paglalarawan: | CAP ALUM POLY 330UF 20% 4V SMD |
| kapasidad: | 330µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EEF-UE0G331ER
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers