Bumili EEU-TA1J330B sa BYCHPS
Bumili na may garantiya
EEU-TA1J330B
- Numero ng Bahagi:
- EEU-TA1J330B
- Manufacturer:
- Panasonic
- Paglalarawan:
- CAP ALUM 33UF 20% 63V RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18527 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EEU-TA1J330B, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EEU-TA1J330B sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 63V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 0.394" Dia (10.00mm) |
| serye: | TA |
| Ripple Kasalukuyang: | 266.5mA @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Tape & Box (TB) |
| Package / Kaso: | Radial, Can |
| Ibang pangalan: | EEUTA1J330B |
| operating Temperature: | -40°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | EEU-TA1J330B |
| Lifetime @ Temp.: | 2000 Hrs @ 125°C |
| Lead Spacing: | 0.197" (5.00mm) |
| impedance: | 360 mOhm |
| Taas - Makaupo (Max): | 0.532" (13.50mm) |
| Ang pinalawak Paglalarawan: | 33µF 63V Aluminum Capacitors Radial, Can 2000 Hrs @ 125°C |
| ESR (Katumbas Series pagtutol): | - |
| paglalarawan: | CAP ALUM 33UF 20% 63V RADIAL |
| kapasidad: | 33µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EEU-TA1J330B
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers