Bumili EP20K60EFC324-1X sa BYCHPS
Bumili na may garantiya
EP20K60EFC324-1X
- Numero ng Bahagi:
- EP20K60EFC324-1X
- Manufacturer:
- Altera (Intel)
- Paglalarawan:
- IC FPGA 196 I/O 324FBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13189 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EP20K60EFC324-1X, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EP20K60EFC324-1X sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.71 V ~ 1.89 V |
|---|---|
| Kabuuang RAM Bits: | 32768 |
| Supplier aparato Package: | 324-FBGA (19x19) |
| serye: | APEX-20KE® |
| Package / Kaso: | 324-BGA |
| operating Temperature: | 0°C ~ 85°C (TJ) |
| Bilang ng Logic Elements / Cells: | 2560 |
| Bilang ng mga Labs / CLBs: | 2560 |
| Bilang ng I / O: | 196 |
| Bilang ng mga Gates: | 162000 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | EP20K60EFC324-1X |
| paglalarawan: | IC FPGA 196 I/O 324FBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EP20K60EFC324-1X
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
EP20K60EFC324-3 | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
|
EP20K60EFC324-2N | Altera | IC FPGA | Pagtatanong |
|
EP20K60EFC324-2X | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
|
EP20K60EFC324-1N | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
|
EP20K60EFC324-3N | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
|
EP20K60EFC324-1 | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
|
EP20K60EFC324-2 | Altera | IC FPGA 196 I/O 324FBGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers