Bumili EP2C70F896I8 sa BYCHPS
Bumili na may garantiya
EP2C70F896I8
- Numero ng Bahagi:
- EP2C70F896I8
- Manufacturer:
- Altera (Intel)
- Paglalarawan:
- IC FPGA 622 I/O 896FBGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 15943 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EP2C70F896I8, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EP2C70F896I8 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.15 V ~ 1.25 V |
|---|---|
| Kabuuang RAM Bits: | 1152000 |
| Supplier aparato Package: | 896-FBGA (31x31) |
| serye: | Cyclone® II |
| Package / Kaso: | 896-BGA |
| Ibang pangalan: | 544-2146 |
| operating Temperature: | -40°C ~ 100°C (TJ) |
| Bilang ng Logic Elements / Cells: | 68416 |
| Bilang ng mga Labs / CLBs: | 4276 |
| Bilang ng I / O: | 622 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | EP2C70F896I8 |
| paglalarawan: | IC FPGA 622 I/O 896FBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EP2C70F896I8
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
EP2C70F896C8 | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896C6 | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896C8N | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896I8N | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896C7 | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896C6N | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
|
EP2C70F896C7N | Altera | IC FPGA 622 I/O 896FBGA | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers