Bumili ER1025-31JM sa BYCHPS
Bumili na may garantiya
ER1025-31JM
- Numero ng Bahagi:
- ER1025-31JM
- Manufacturer:
- API Delevan
- Paglalarawan:
- FIXED IND 3UH 270MA 850 MOHM TH
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 16790 Pieces
- Data sheet:
- ER1025-31JM.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ER1025-31JM, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ER1025-31JM sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Molded |
|---|---|
| pagpapaubaya: | ±5% |
| Supplier aparato Package: | - |
| Sukat / Dimension: | 0.095" Dia x 0.250" L (2.41mm x 6.35mm) |
| shielding: | Unshielded |
| serye: | ER1025 |
| Ratings: | - |
| Q @ Freq: | 37 @ 7.9MHz |
| packaging: | Bulk |
| Package / Kaso: | Axial |
| Ibang pangalan: | ER1025-31JM 3500 TR ER1025-31JM-MIL |
| operating Temperature: | -55°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Iron |
| Manufacturer Bilang Bahagi: | ER1025-31JM |
| inductance: | 3µH |
| Taas - Makaupo (Max): | - |
| Frequency - Test: | 7.9MHz |
| Frequency - Self Resonant: | 90MHz |
| Ang pinalawak Paglalarawan: | 3µH Unshielded Molded Inductor 270mA 850 mOhm Max Axial |
| paglalarawan: | FIXED IND 3UH 270MA 850 MOHM TH |
| DC pagtutol (DCR): | 850 mOhm Max |
| kasalukuyang Rating: | 270mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ER1025-31JM
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers