Bumili ESD63C225K4T2A-30 sa BYCHPS
Bumili na may garantiya
ESD63C225K4T2A-30
- Numero ng Bahagi:
- ESD63C225K4T2A-30
- Manufacturer:
- AVX Corporation
- Paglalarawan:
- CAP CER 2.2UF 25V X7R 1206
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13217 Pieces
- Data sheet:
- ESD63C225K4T2A-30.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ESD63C225K4T2A-30, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ESD63C225K4T2A-30 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 25V |
|---|---|
| pagpapaubaya: | ±10% |
| temperatura koepisyent: | X7R |
| Sukat / Dimension: | 0.125" L x 0.063" W (3.18mm x 1.60mm) |
| serye: | ESD-SAFE™ |
| Ratings: | AEC-Q200 |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric) |
| Ibang pangalan: | 478-8033-2 ESD63C225K4T2A-30/2K ESD63C225K4T2A30 |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 23 Weeks |
| Manufacturer Bilang Bahagi: | ESD63C225K4T2A-30 |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | 2.2µF ±10% 25V Ceramic Capacitor X7R 1206 (3216 Metric) |
| paglalarawan: | CAP CER 2.2UF 25V X7R 1206 |
| kapasidad: | 2.2µF |
| aplikasyon: | Automotive, ESD Protection |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ESD63C225K4T2A-30
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers