Bumili EWK316B7225KD-T sa BYCHPS
Bumili na may garantiya
EWK316B7225KD-T
- Numero ng Bahagi:
- EWK316B7225KD-T
- Manufacturer:
- Taiyo Yuden
- Paglalarawan:
- CAP CER 2.2UF 16V X7R 0612
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12012 Pieces
- Data sheet:
- EWK316B7225KD-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa EWK316B7225KD-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa EWK316B7225KD-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 16V |
|---|---|
| pagpapaubaya: | ±10% |
| Kapal (Max): | 0.033" (0.85mm) |
| temperatura koepisyent: | X7R |
| Sukat / Dimension: | 0.063" L x 0.126" W (1.60mm x 3.20mm) |
| serye: | EWK |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 0612 (1632 Metric) |
| Ibang pangalan: | 587-1784-2 CE EWK316 B7225KD-T EWK316B7225KDT |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | EWK316B7225KD-T |
| Lead Style: | - |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Mga tampok: | Low ESL (Reverse Geometry) |
| Ang pinalawak Paglalarawan: | 2.2µF ±10% 16V Ceramic Capacitor X7R 0612 (1632 Metric) |
| paglalarawan: | CAP CER 2.2UF 16V X7R 0612 |
| kapasidad: | 2.2µF |
| aplikasyon: | Bypass, Decoupling |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa EWK316B7225KD-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers