Bumili FBMH3216HM501NTV sa BYCHPS
Bumili na may garantiya
FBMH3216HM501NTV
- Numero ng Bahagi:
- FBMH3216HM501NTV
- Manufacturer:
- Taiyo Yuden
- Paglalarawan:
- FERRITE BEAD,HIGH CURRENT CHIP,1
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13908 Pieces
- Data sheet:
- FBMH3216HM501NTV.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FBMH3216HM501NTV, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FBMH3216HM501NTV sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Ibang pangalan: | 587-5437-2 FC FB MH3216HM501NTV |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | FBMH3216HM501NTV |
| paglalarawan: | FERRITE BEAD,HIGH CURRENT CHIP,1 |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FBMH3216HM501NTV
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
FBMH3216HM501NT | Taiyo Yuden | FERRITE BEAD 500 OHM 1206 1LN | Pagtatanong |
|
FBMH3216HM221NTV | Taiyo Yuden | FERRITE BEAD 220 OHM 1206 1LN | Pagtatanong |
|
FBMH3225HM601NTV | Taiyo Yuden | FERRITE BEAD 600 OHM 1210 1LN | Pagtatanong |
|
FBMH3216HM221NT | Taiyo Yuden | FERRITE BEAD 220 OHM 1206 1LN | Pagtatanong |
|
FBMH3225HM202NTV | Taiyo Yuden | FERRITE BEAD 2 KOHM 1210 1LN | Pagtatanong |
|
FBMH3225HM102NTV | Taiyo Yuden | FERRITE BEAD 1 KOHM 1210 1LN | Pagtatanong |
|
FBMH3225HM601NT | Taiyo Yuden | FERRITE BEAD 600 OHM 1210 1LN | Pagtatanong |
|
FBMH3225HM102NT | Taiyo Yuden | FERRITE BEAD 1 KOHM 1210 1LN | Pagtatanong |
|
FBMH3225HM202NT | Taiyo Yuden | FERRITE BEAD 2 KOHM 1210 1LN | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers