Bumili FCA-210-0926M sa BYCHPS
Bumili na may garantiya
FCA-210-0926M
- Numero ng Bahagi:
- FCA-210-0926M
- Manufacturer:
- Aerospace Defense and Marine / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE DPDT 10A 28V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 14336 Pieces
- Data sheet:
- 1.FCA-210-0926M.pdf2.FCA-210-0926M.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FCA-210-0926M, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FCA-210-0926M sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 18 VDC |
|---|---|
| I-off ang Boltahe (Min): | 1.5 VDC |
| pagwawakas Style: | Solder Hook |
| Paglipat Boltahe: | 115VAC, 28VDC - Max |
| serye: | Military, MIL-R-83536/9, FCA, CII |
| release Time: | 10ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 1122-1114 1122-1114-MIL 1617749-2 A101675 A101675-ND FCA-210-0926M-ND FCA2100926M M83536/9-026M |
| operating Temperature: | -70°C ~ 125°C |
| Magpapatakbo Time: | 10ms |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | FCA-210-0926M |
| Mga tampok: | Sealed - Hermetically |
| Ang pinalawak Paglalarawan: | General Purpose Relay DPDT (2 Form C) 28VDC Coil Chassis Mount |
| paglalarawan: | RELAY GEN PURPOSE DPDT 10A 28V |
| Contact Rating (Kasalukuyang): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | DPDT (2 Form C) |
| Coil Boltahe: | 28VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 320 Ohms |
| Coil Power: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FCA-210-0926M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers