Bumili FDB86566_F085 sa BYCHPS
Bumili na may garantiya
FDB86566_F085
- Numero ng Bahagi:
- FDB86566_F085
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- MOSFET N-CH 60V 110A D2PAK
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16730 Pieces
- Data sheet:
- FDB86566_F085.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FDB86566_F085, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FDB86566_F085 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 4V @ 250µA |
|---|---|
| Vgs (Max): | ±20V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | D²PAK (TO-263AB) |
| serye: | Automotive, AEC-Q101, PowerTrench® |
| Rds On (Max) @ Id, Vgs: | 2.7 mOhm @ 80A, 10V |
| Power pagwawaldas (Max): | 176W (Tj) |
| packaging: | Original-Reel® |
| Package / Kaso: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Ibang pangalan: | FDB86566_F085DKR |
| operating Temperature: | -55°C ~ 175°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | FDB86566_F085 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 6655pF @ 30V |
| Gate Charge (Qg) (Max) @ Vgs: | 110nC @ 10V |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 60V 110A (Tc) 176W (Tj) Surface Mount D²PAK (TO-263AB) |
| Drive Boltahe (Max Rds On, Min Rds On): | 10V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 60V |
| paglalarawan: | MOSFET N-CH 60V 110A D2PAK |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 110A (Tc) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FDB86566_F085
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog