Bumili FEP16CT/45 sa BYCHPS
Bumili na may garantiya
FEP16CT/45
- Numero ng Bahagi:
- FEP16CT/45
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- DIODE ARRAY GP 150V 16A TO220AB
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 19597 Pieces
- Data sheet:
- 1.FEP16CT/45.pdf2.FEP16CT/45.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FEP16CT/45, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FEP16CT/45 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 950mV @ 8A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 150V |
| Supplier aparato Package: | TO-220AB |
| bilis: | Fast Recovery = 200mA (Io) |
| serye: | - |
| Reverse Recovery Time (trr): | 35ns |
| packaging: | Bulk |
| Package / Kaso: | TO-220-3 |
| Ibang pangalan: | FEP16CT FEP16CT/45GI FEP16CTGI FEP16CTGI-ND |
| Operating Temperature - Junction: | -55°C ~ 150°C |
| Salalayan Type: | Through Hole |
| Manufacturer Bilang Bahagi: | FEP16CT/45 |
| Ang pinalawak Paglalarawan: | Diode Array 1 Pair Common Cathode Standard 150V 16A Through Hole TO-220-3 |
| Type diode: | Standard |
| diode Configuration: | 1 Pair Common Cathode |
| paglalarawan: | DIODE ARRAY GP 150V 16A TO220AB |
| Current - Reverse pagtagas @ Vr: | 10µA @ 150V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 16A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FEP16CT/45
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers