Bumili FG18C0G2A090DNT06 sa BYCHPS
Bumili na may garantiya
FG18C0G2A090DNT06
- Numero ng Bahagi:
- FG18C0G2A090DNT06
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- CAP CER 9PF 100V C0G RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13616 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FG18C0G2A090DNT06, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FG18C0G2A090DNT06 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 100V |
|---|---|
| pagpapaubaya: | ±0.5pF |
| Kapal (Max): | - |
| temperatura koepisyent: | C0G, NP0 |
| Sukat / Dimension: | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
| serye: | FG |
| Ratings: | - |
| packaging: | Tape & Box (TB) |
| Package / Kaso: | Radial |
| Ibang pangalan: | 445-173218 445-173218-3 445-173218-ND |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | FG18C0G2A090DNT06 |
| Lead Style: | Formed Leads |
| Lead Spacing: | 0.098" (2.50mm) |
| Taas - Makaupo (Max): | 0.217" (5.50mm) |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 9pF ±0.5pF 100V Ceramic Capacitor C0G, NP0 Radial |
| paglalarawan: | CAP CER 9PF 100V C0G RADIAL |
| kapasidad: | 9pF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FG18C0G2A090DNT06
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers