Bumili FGH30T65UPDT_F155 sa BYCHPS
Bumili na may garantiya
FGH30T65UPDT_F155
- Numero ng Bahagi:
- FGH30T65UPDT_F155
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- IGBT 650V 60A 250W TO247-3
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16590 Pieces
- Data sheet:
- FGH30T65UPDT_F155.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FGH30T65UPDT_F155, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FGH30T65UPDT_F155 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 650V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 2.3V @ 15V, 30A |
| Test Kundisyon: | 400V, 30A, 8 Ohm, 15V |
| Td (on / off) @ 25 ° C: | 22ns/139ns |
| Ang paglipat Energy: | 760µJ (on), 400µJ (off) |
| Supplier aparato Package: | TO-247 Long Leads |
| serye: | - |
| Reverse Recovery Time (trr): | 43ns |
| Power - Max: | 250W |
| packaging: | Tube |
| Package / Kaso: | TO-247-3 |
| operating Temperature: | -55°C ~ 175°C (TJ) |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | FGH30T65UPDT_F155 |
| Type input: | Standard |
| Type IGBT: | Trench Field Stop |
| gate charge: | 155nC |
| Ang pinalawak Paglalarawan: | IGBT Trench Field Stop 650V 60A 250W Through Hole TO-247 Long Leads |
| paglalarawan: | IGBT 650V 60A 250W TO247-3 |
| Current - Kolektor Pulsed (Icm): | 90A |
| Current - kolektor (Ic) (Max): | 60A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FGH30T65UPDT_F155
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog