Bumili FIN212ACGFX sa BYCHPS
Bumili na may garantiya
FIN212ACGFX
- Numero ng Bahagi:
- FIN212ACGFX
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- IC SER/DESER 12BIT 42USS-BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14074 Pieces
- Data sheet:
- FIN212ACGFX.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FIN212ACGFX, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FIN212ACGFX sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.65 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 42-USS-BGA (3.5x4.5) |
| serye: | µSerDes™ |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 42-VFBGA |
| Type output: | LVCMOS |
| Ibang pangalan: | FIN212ACGFXTR |
| operating Temperature: | -30°C ~ 70°C (TA) |
| Bilang ng mga Outputs: | 2/12 |
| Bilang ng mga Inputs: | 12/2 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Bilang Bahagi: | FIN212ACGFX |
| Type input: | LVCMOS |
| tungkulin: | Serializer/Deserializer |
| Ang pinalawak Paglalarawan: | Serializer/Deserializer 12/2 Input 2/12 Output 42-USS-BGA (3.5x4.5) |
| paglalarawan: | IC SER/DESER 12BIT 42USS-BGA |
| Rate data: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FIN212ACGFX
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
MAX9259GCB/V+GB | Maxim Integrated | IC SERIALIZER GMSL 64TQFP | Pagtatanong |
 |
FIN212ACMLX | Fairchild/ON Semiconductor | IC SERIAL/DESERIAL 12BIT 32MLP | Pagtatanong |
 |
FIN210ACGFX | Fairchild/ON Semiconductor | IC SER/DES 10BIT 42-USSBGA | Pagtatanong |
 |
DS90UB921TRHSTQ1 | Texas Instruments | IC SERIALIZER 720P 48WQFN | Pagtatanong |
 |
FIN210ACMLX | Fairchild/ON Semiconductor | IC SER/DES 10BIT 32-MLP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers