Bumili FPF1C2P5MF07AM sa BYCHPS
Bumili na may garantiya
FPF1C2P5MF07AM
- Numero ng Bahagi:
- FPF1C2P5MF07AM
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- 620V 30A DC/AC HIGH POWER MOD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12805 Pieces
- Data sheet:
- FPF1C2P5MF07AM.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FPF1C2P5MF07AM, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FPF1C2P5MF07AM sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 620V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.6V @ 15V, 30A |
| Supplier aparato Package: | F1 |
| serye: | - |
| Power - Max: | 231W |
| Package / Kaso: | F1 Module |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | FPF1C2P5MF07AM |
| Input Kapasidad (CIEs) @ Vce: | - |
| input: | Single Phase Bridge Rectifier |
| Type IGBT: | - |
| Ang pinalawak Paglalarawan: | IGBT Module Full Bridge Inverter 620V 39A 231W Chassis Mount F1 |
| paglalarawan: | 620V 30A DC/AC HIGH POWER MOD |
| Current - Kolektor Cutoff (Max): | 25µA |
| Current - kolektor (Ic) (Max): | 39A |
| configuration: | Full Bridge Inverter |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FPF1C2P5MF07AM
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
FP7G100US60 | Fairchild/ON Semiconductor | MODULE SPM 600V 100A EPM7 | Pagtatanong |
 |
FPF1C2P5BF07A | Fairchild/ON Semiconductor | MOSFET 5N-CH 650V 36A F1 MODULE | Pagtatanong |
 |
MIO 600-65E11 | IXYS | MOD IGBT SGL SWITCH 6500V E11 | Pagtatanong |
 |
IRG5W50HF06A | Infineon Technologies | MOD IGBT 600V 50A POWIR 34 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers